10 Gbit/s hybrid integrated photoreceiver array module using a planar lightwave circuit platform

Author

Ohyama, T. ; Mino, S. ; Akahori, Y. ; Yanagisawa, M. ; Hashimoto, T. ; Yamada, Y. ; Muramoto, Y. ; Tsunetsugu, H.

Author_Institution

NTT Opto-Electron. Labs., Ibaraki, Japan

Volume

32

Issue

9

fYear

1996

fDate

4/25/1996 12:00:00 AM

Firstpage

845

Lastpage

846

Abstract

A high speed optoelectronic hybrid integrated photoreceiver module has been developed using a silica-based planar lightwave circuit (PLC) and a monolithically integrated photoreceiver array. The hybrid integrated photoreceiver module employs two-layer electrical wiring and solder-bump connections for multigigabit/s operation. The module exhibits a very wide 3 dB down bandwidth of 8 GHz, which enables operation at 10 Gbit/s

Keywords

high-speed optical techniques; integrated optoelectronics; optical interconnections; optical receivers; optical waveguide components; silicon compounds; 10 Gbit/s; 8 GHz; Si; SiO₂-Si; high speed optoelectronic hybrid integrated photoreceiver module; hybrid integrated photoreceiver array module; hybrid integrated photoreceiver module; monolithically integrated photoreceiver array; multigigabit/s operation; planar lightwave circuit platform; silica-based planar lightwave circuit; solder-bump connections; two-layer electrical wiring;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el:19960527

Filename

492959