DocumentCode
882191
Title
Optimum load device for DMOS integrated circuits
Author
Benz, H.F.
Volume
11
Issue
4
fYear
1976
fDate
8/1/1976 12:00:00 AM
Firstpage
443
Lastpage
452
Abstract
Depletion-mode load devices can be integrated with DMOS transistors without any extra diffusions or implantation processing steps by judicious choice of the substrate crystal orientation and resistivity. For low voltage operation, <1,1,1> crystal orientation should be used. The <1,1,1> crystal orientation also yields a higher transconductance for the DMOS transistor than the <1,0,0> orientation. The geometry of the load device and the DMOS transistor can be made ratioless to conserve area. Self-aligned gates, hitherto considered incompatible with DMOS transistors, have been incorporated in the structure. The experimental DMOS invertors, using a conservative design, have achieved 4-ns propagation delay, 1.3-V operation and 2-pJ propagation delay-power dissipation product.
Keywords
Field effect transistors; Monolithic integrated circuits; field effect transistors; monolithic integrated circuits; Circuits; Conductivity; Geometry; Inverters; Ion implantation; Low voltage; MOSFETs; NASA; Propagation delay; Transconductance;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1976.1050757
Filename
1050757
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