Title :
Computer simulation of integrated circuits in the presence of electrothermal interaction
Author :
Fukahori, Kiyoshi ; Gray, Paul R.
fDate :
12/1/1976 12:00:00 AM
Abstract :
A computer program which predicts the DC and transient performance of monolithic integrated circuits in the presence of electrothermal interactions on the integrated circuit die is described. The thermal modeling of the die/package structure and the numerical analysis procedure is discussed. Experimental and simulation results are compared for monolithic operational amplifiers, voltage regulators, and a temperature-stabilized voltage reference.
Keywords :
Circuit CAD; Circuit analysis computing; Linear integrated circuits; Modelling; Monolithic integrated circuits; Simulation; circuit CAD; circuit analysis computing; linear integrated circuits; modelling; monolithic integrated circuits; simulation; Circuit simulation; Computational modeling; Computer simulation; Electrothermal effects; Integrated circuit packaging; Monolithic integrated circuits; Numerical analysis; Operational amplifiers; Regulators; Voltage;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1976.1050825
