DocumentCode
885479
Title
Integrated-circuit thermal modeling
Author
Castello, Rinaldo ; Antognetti, Paolo
Volume
13
Issue
3
fYear
1978
fDate
6/1/1978 12:00:00 AM
Firstpage
363
Lastpage
366
Abstract
The static heat-flow problem has been solved analytically in three dimensions for a two-blocks structure. The computer program calculating the temperature maps is simple and fast. Examples are given of temperature profiles on the chip surface of a high-power IC.
Keywords
Monolithic integrated circuits; Semiconductor device models; monolithic integrated circuits; semiconductor device models; Copper; Heat sinks; Integrated circuit modeling; Power amplifiers; Power integrated circuits; Silicon; Temperature distribution; Thermal conductivity; Thermal factors; Voltage;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1978.1051054
Filename
1051054
Link To Document