Title :
Fine pitch wire bonding development using a new multipurpose, multipad pitch test die
Author_Institution :
VLSI Technol. Inc., San Jose, CA, USA
fDate :
12/1/1991 12:00:00 AM
Abstract :
A multipurpose, multipad pitch test die with pad pitches ranging from 5 mil down to 3 mil, suitable for evaluating gold-ball bonding, aluminum wedge bonding, tape automated bonding (TAB), array bonding, wafer probes, and molding operations is discussed. The author reviews the design features of this test die and presents the statistical design of the experiment strategy taken in developing a wire bond process for very fine pitch assembly based on this test die. The effect of major bonding parameters on bond ball shear force is discussed. A statistical method for predicting the ball shorting rate is compared with assembly yield data
Keywords :
integrated circuit technology; lead bonding; packaging; tape automated bonding; 5 to 3 mil; Al wedge bonding; Au ball bonding; TAB; array bonding; ball shorting rate; bond ball shear force; design features; fine pitch wire bonding; molding operations; multipad pitch test die; response surface methodology; shear force; statistical design; tape automated bonding; very fine pitch assembly; wafer probes; Aluminum; Assembly; Automatic testing; Bonding forces; Costs; Plastic packaging; Semiconductor device packaging; Very large scale integration; Wafer bonding; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
