• DocumentCode
    886702
  • Title

    Metallurgical changes in tin-lead platings due to heat aging

  • Author

    Geckle, Raymond J.

  • Author_Institution
    AMP Inc., Harrisburg, PA, USA
  • Volume
    14
  • Issue
    4
  • fYear
    1991
  • fDate
    12/1/1991 12:00:00 AM
  • Firstpage
    691
  • Lastpage
    697
  • Abstract
    One-inch test samples of bright and matte tin-lead platings over both copper and nickel substrates were examined after heat aging for various times at 150°C in forming gas. The intermetallic compounds formed are somewhat harder and more brittle than the platings. Therefore, as the intermetallic growth approaches the outer surface of the platings, various surface properties may be altered. Generally, the coefficient of friction decreases with a corresponding increase in wearability and contact resistance. The formation of the intermetallic continues as long as there are sufficient amounts of the alloying constituents present. Samples aged to simulate a period of time for storage exhibited an increase in contact resistance when compared to as-received samples
  • Keywords
    ageing; chemical interdiffusion; contact resistance; electrical contacts; electroplated coatings; friction; lead alloys; tin alloys; wear; 150 degC; Cu substrate; Ni substrate; SnPb-Cu; SnPb-Ni; bright coatings; contact resistance; friction coefficient; heat aging; intermetallic compounds; matte coatings; platings; surface properties; wearability; Aging; Connectors; Contact resistance; Copper; Intermetallic; Nickel; Surface cracks; Surface resistance; Temperature; Tin;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.105118
  • Filename
    105118