DocumentCode
886702
Title
Metallurgical changes in tin-lead platings due to heat aging
Author
Geckle, Raymond J.
Author_Institution
AMP Inc., Harrisburg, PA, USA
Volume
14
Issue
4
fYear
1991
fDate
12/1/1991 12:00:00 AM
Firstpage
691
Lastpage
697
Abstract
One-inch test samples of bright and matte tin-lead platings over both copper and nickel substrates were examined after heat aging for various times at 150°C in forming gas. The intermetallic compounds formed are somewhat harder and more brittle than the platings. Therefore, as the intermetallic growth approaches the outer surface of the platings, various surface properties may be altered. Generally, the coefficient of friction decreases with a corresponding increase in wearability and contact resistance. The formation of the intermetallic continues as long as there are sufficient amounts of the alloying constituents present. Samples aged to simulate a period of time for storage exhibited an increase in contact resistance when compared to as-received samples
Keywords
ageing; chemical interdiffusion; contact resistance; electrical contacts; electroplated coatings; friction; lead alloys; tin alloys; wear; 150 degC; Cu substrate; Ni substrate; SnPb-Cu; SnPb-Ni; bright coatings; contact resistance; friction coefficient; heat aging; intermetallic compounds; matte coatings; platings; surface properties; wearability; Aging; Connectors; Contact resistance; Copper; Intermetallic; Nickel; Surface cracks; Surface resistance; Temperature; Tin;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.105118
Filename
105118
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