• DocumentCode
    887275
  • Title

    Scrapping small lots in a low-yield and high-price scenario

  • Author

    Wu, Muh-Cherng ; Chiou, Chie-Wun ; Hsu, Hsi-Mei

  • Author_Institution
    Dept. of Ind. Eng. & Manage., Nat. Chiao Tung Univ., Taiwan, Taiwan
  • Volume
    17
  • Issue
    1
  • fYear
    2004
  • Firstpage
    55
  • Lastpage
    67
  • Abstract
    Some wafers in a lot may become spoiled after they are processed at a workstation; such a lot is called a small lot. In a low yield and high price scenario, scrapping small lots may increase revenue and profit; yet, this notion has seldom been examined. This study presents a model for formulating the decision-making problem of scrapping small lots. A genetic algorithm is used to solve the problem when the solution space is large. An exhaustive search method is used when the solution space is small. Some numerical examples are used to evaluate the outcome of scrapping small lots. The profit obtained by the proposed scrapping method may be up to 23% higher than that obtained without scrapping.
  • Keywords
    decision support systems; genetic algorithms; integrated circuit economics; integrated circuit yield; production management; decision-making problem; genetic algorithm; high-price; low-yield; profit; revenue; small lots; wafers; Chemical processes; Costs; Decision making; Fabrication; Genetic algorithms; Merging; Production facilities; Search methods; Semiconductor device modeling; Workstations;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2003.822732
  • Filename
    1265768