DocumentCode
887275
Title
Scrapping small lots in a low-yield and high-price scenario
Author
Wu, Muh-Cherng ; Chiou, Chie-Wun ; Hsu, Hsi-Mei
Author_Institution
Dept. of Ind. Eng. & Manage., Nat. Chiao Tung Univ., Taiwan, Taiwan
Volume
17
Issue
1
fYear
2004
Firstpage
55
Lastpage
67
Abstract
Some wafers in a lot may become spoiled after they are processed at a workstation; such a lot is called a small lot. In a low yield and high price scenario, scrapping small lots may increase revenue and profit; yet, this notion has seldom been examined. This study presents a model for formulating the decision-making problem of scrapping small lots. A genetic algorithm is used to solve the problem when the solution space is large. An exhaustive search method is used when the solution space is small. Some numerical examples are used to evaluate the outcome of scrapping small lots. The profit obtained by the proposed scrapping method may be up to 23% higher than that obtained without scrapping.
Keywords
decision support systems; genetic algorithms; integrated circuit economics; integrated circuit yield; production management; decision-making problem; genetic algorithm; high-price; low-yield; profit; revenue; small lots; wafers; Chemical processes; Costs; Decision making; Fabrication; Genetic algorithms; Merging; Production facilities; Search methods; Semiconductor device modeling; Workstations;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2003.822732
Filename
1265768
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