Title :
Combination of numerical and experimental methods for stress analysis of small electronic components
Author :
Villain, Jürgen ; Borner, Hartwig
Author_Institution :
Siemens Nixdorf Informationssyst. AG, Munich, Germany
fDate :
12/1/1991 12:00:00 AM
Abstract :
Examples of the development of a multichip module with extremely loaded components are presented. It is shown that a reasonable combination of experimental methods, e.g. holographic interferometry, metallography, and a good knowledge of the specific material behavior under working conditions result in better numerical simulation under realistic boundary conditions. This allows shape and material optimization during the development phase to achieve components with high reliability in a short development time
Keywords :
holographic interferometry; integrated circuit technology; metallography; modules; numerical analysis; packaging; stress analysis; LSI packaging; boundary conditions; high reliability; holographic interferometry; material optimization; metallography; multichip module; numerical simulation; plated through blind holes; small electronic components; stress analysis; Boundary conditions; Employee welfare; Holography; Inorganic materials; Interferometry; Materials reliability; Multichip modules; Numerical simulation; Shape; Stress;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
