Title :
Foreword Contributions From SEMI-THERM 21
fDate :
6/1/2007 12:00:00 AM
Abstract :
The five papers in this special section are drawn from different oral sessions at SEMI-THERM 21 that reflect the current challenges faced by the industry in microscale liquid cooling, thermal interface material development, interface resistance minimization, and stacked die.
Keywords :
Bonding; Electrical resistance measurement; Liquid cooling; Microchannel; Moore´s Law; Packaging; Silicon; Temperature measurement; Testing; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.898495
