Development of Ag Alloy Thin Film With Both High Reflectance and Adhesion for High Density Opt-Electronic Module

Author

Kuroda, Akihiro ; Satoh, Ryohei ; Iwata, Yoshiharu ; Yokota, Koichi ; Fujimoto, Kozo ; Ura, Shogo ; Kintaka, Kenji

Author_Institution

Sanyo Electr. Co. Ltd., Osaka

Volume

30

Issue

2

fYear

2007

fDate

6/1/2007 12:00:00 AM

Firstpage

302

Lastpage

308

Abstract

We have developed a new multilayered reflection film structure containing Ag films for achieving slab waveguide based optical transmission interconnections between large scale integrated chips for next generation high-speed computers. We applied Cr to both adhere the Ag to the SiO₂ optical layer and to inhibit diffusion of Ag into SiO₂. Although we found that Cr tends to decrease the reflectance, we found that it is possible to satisfy both adhesiveness and reflectance requirements by adjusting the film thickness

Keywords

adhesion; chromium; electroreflectance; integrated circuit packaging; modules; multilayers; optical interconnections; silicon compounds; silver; system buses; thin film circuits; waveguides; Ag; Ag alloy thin film; Cr; SiO₂; adhesion; grating; high density packaging; high reflectance; optical interconnection; optoelectronic module; thermal stability; waveguide; Adhesives; Chromium; High speed optical techniques; Optical films; Optical interconnections; Optical reflection; Optical waveguides; Reflectivity; Slabs; Transistors; Adhesion; Ag reflection film; grating; high-density packaging; optical interconnection; thermal stability; waveguide;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2007.897974

Filename

4214945