DocumentCode
896745
Title
Delayed relaxation in thin-film heads
Author
Klaassen, K.B. ; van Peppen, J.C.L.
Author_Institution
IBM Almaden Res. Center, San Jose, CA, USA
Volume
25
Issue
5
fYear
1989
fDate
9/1/1989 12:00:00 AM
Firstpage
3212
Lastpage
3214
Abstract
The delayed relaxation after writing with a Permalloy thin-film head has been studied experimentally. The phenomenon of delayed relaxation is shown to be caused predominantly by stress-induced relaxation of the flux closure domains along the edges of the thin-film-head yoke. It is necessary for this effect that the composition of the Permalloy yields nonzero magnetostriction. The fairly rapid temperature change directly after write will then trigger irreversible wall displacements which show up as transient noise pulses in the head output. Depending on the actual edge domain relaxation, these transients can have a positive or a negative polarity, or can be bipolarity transients. This thermomechanically triggered irreversible wall-motion process can fairly accurately be modeled as a Poisson process. The model predicts the arrival time distribution, the probability of occurrence for different write currents, and threshold settings reasonably well. This `noise-after-write´ effect can be made smaller by striving for zero magnetostriction and a lower write power dissipation, and to some extent by increasing the thermal conductivity to the slider
Keywords
Permalloy; magnetic domain walls; magnetic heads; magnetic relaxation; magnetic thin film devices; transient response; Fe-Ni alloy; Permalloy; Poisson process; arrival time distribution; delayed relaxation; edge domain relaxation; flux closure domains; irreversible wall displacements; model; nonzero magnetostriction; occurrence probability; stress-induced relaxation; thermal conductivity; thermomechanically triggered process; thin-film heads; threshold settings; transient noise pulses; transients; write currents; write power dissipation; yoke edges; zero magnetostriction; Delay; Magnetic heads; Magnetostriction; Power dissipation; Predictive models; Temperature; Thermal conductivity; Thermomechanical processes; Transistors; Writing;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.42257
Filename
42257
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