Packaging a 150-W bipolar ECL microprocessor

Author

Hamburgen, William R. ; Fitch, John S.

Author_Institution

Digital Equipment Corp., Palo Alto, CA, USA

Volume

16

Issue

1

fYear

1993

fDate

2/1/1993 12:00:00 AM

Firstpage

28

Lastpage

38

Abstract

Recent developments in computer-aided design (CAD) have made highly automated layout of custom emitter coupled logic (ECL) circuits possible. These layouts have a much higher circuit and power density than gate array designs. It is now possible to place an entire ECL microprocessor, including floating point unit and cache memory, on one large die. To demonstrate the capability of supporting such a die, low-cost air-cooled single-chip packaging was built and tested for a 12.6-mm by 15.4-mm die. The plastic pin grid array (PPGA) package supplied the required current and maintained junction temperatures at less than 100°C while dissipating 150 W. This required innovation in five areas: die metalization, bondwire layout, PPGA package design, die attach, and cooling by a thermosiphon

Keywords

bipolar integrated circuits; cooling; emitter-coupled logic; lead bonding; metallisation; microprocessor chips; packaging; 12.6 mm; 15.4 mm; 150 mW; PPGA; PPGA package design; air-cooled; bipolar ECL microprocessor; bondwire layout; die attach; die metalization; low-cost; plastic pin grid array; single-chip packaging; thermosiphon cooling; Cache memory; Circuit testing; Coupling circuits; Current supplies; Design automation; Electronics packaging; Logic circuits; Logic design; Microprocessors; Plastic packaging;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.214857

Filename

214857