Title :
Multilevel LINC System Designs for Power Efficiency Enhancement of Transmitters
Author :
Kai-Yuan Jheng ; Yuan-Jyue Chen ; An-Yeu Wu
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
fDate :
6/1/2009 12:00:00 AM
Abstract :
To meet the linearity requirements of novel wireless communication standards using varying-envelope modulations, the class A power amplifier (PA) in the traditional transmitters must be highly backed off to work in the linear region where power efficiency drops rapidly. As for the PA linearization technique, linear amplifier with nonlinear components (LINC), achieves linear amplification without power backoff. However, the combiner power efficiency of the LINC system degrades significantly for signals with a high peak-to-average power ratio. In this paper, we propose a multilevel out-phasing (MOP) scheme to achieve high combiner efficiency by reducing the signal dynamics. Furthermore, based on the MOP, we design two architectures: envelope-adjusting MLINC (EA-MLINC) and gain-adjusting MLINC (GA-MLINC). Under the WCDMA system linearity requirements, the simulations show that 3-level EA-MLINC and 3-level GA-MLINC enhance the LINC system power-added efficiency from 16.5% to 33.4% and 23.6%, respectively.
Keywords :
power amplifiers; transmitters; class A power amplifier; linear amplification; linear amplifier with nonlinear components; linearity requirements; linearization technique; multilevel LINC system; multilevel out-phasing scheme; peak-to-average power ratio; power efficiency enhancement; signal dynamics; transmitters; varying-envelope modulations; wireless communication standards; Communication standards; Degradation; High power amplifiers; Linearity; Linearization techniques; Nonlinear dynamical systems; Peak to average power ratio; Power amplifiers; Transmitters; Wireless communication; Linear amplifier with nonlinear components (LINC); out-phasing technique; power amplifier linearization;
Journal_Title :
Selected Topics in Signal Processing, IEEE Journal of
DOI :
10.1109/JSTSP.2009.2020949