• DocumentCode
    900305
  • Title

    Finite-element analysis of a quartz digital accelerometer

  • Author

    Reedy, E.D., Jr. ; Kass, W.J.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    37
  • Issue
    5
  • fYear
    1990
  • Firstpage
    464
  • Lastpage
    474
  • Abstract
    A detailed three-dimensional (3-D) finite-element analysis of a quartz digital accelerometer (QDA) is carried out to understand and determine the temperature behavior of the entire heterogeneous sensor consisting of quartz resonant elements, polyimide bonding material, and beryllium copper spacers. Of particular interest is the identification of factors that can degrade the temperature stability of the QDA´s output frequency. The calculated temperature dependence of a double-ended tuning fork (DETF) is reported and shown to be in good agreement with measured data. This relation differs from that calculated for a tine and demonstrates the influence of the end boundary conditions. Calculated results for the full QDA include: (1) natural frequencies and mode shapes, (2) the shift in the QDA´s output frequency with acceleration level, and (3) the shift in the QDA´s output frequency with temperature. The effect of varying the thickness of the adhesive bonds between the DETFs and the spacers is examined. These results suggest that variations in bond thickness can generate temperature dependent residual assembly stresses that degrade the thermal stability of the QDA´s output frequency.<>
  • Keywords
    accelerometers; crystal resonators; digital instrumentation; finite element analysis; quartz; 3D finite element analysis; BeCu spacers; SiO/sub 2/; acceleration level; bond thickness; double-ended tuning fork; end boundary conditions; heterogeneous sensor; mode shapes; natural frequencies; output frequency; polyimide bonding material; quartz digital accelerometer; quartz resonant elements; residual assembly stresses; temperature behavior; temperature dependence; thermal stability; Accelerometers; Bonding; Copper; Finite element methods; Frequency; Polyimides; Resonance; Temperature dependence; Temperature sensors; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/58.105253
  • Filename
    105253