DocumentCode
900305
Title
Finite-element analysis of a quartz digital accelerometer
Author
Reedy, E.D., Jr. ; Kass, W.J.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
Volume
37
Issue
5
fYear
1990
Firstpage
464
Lastpage
474
Abstract
A detailed three-dimensional (3-D) finite-element analysis of a quartz digital accelerometer (QDA) is carried out to understand and determine the temperature behavior of the entire heterogeneous sensor consisting of quartz resonant elements, polyimide bonding material, and beryllium copper spacers. Of particular interest is the identification of factors that can degrade the temperature stability of the QDA´s output frequency. The calculated temperature dependence of a double-ended tuning fork (DETF) is reported and shown to be in good agreement with measured data. This relation differs from that calculated for a tine and demonstrates the influence of the end boundary conditions. Calculated results for the full QDA include: (1) natural frequencies and mode shapes, (2) the shift in the QDA´s output frequency with acceleration level, and (3) the shift in the QDA´s output frequency with temperature. The effect of varying the thickness of the adhesive bonds between the DETFs and the spacers is examined. These results suggest that variations in bond thickness can generate temperature dependent residual assembly stresses that degrade the thermal stability of the QDA´s output frequency.<>
Keywords
accelerometers; crystal resonators; digital instrumentation; finite element analysis; quartz; 3D finite element analysis; BeCu spacers; SiO/sub 2/; acceleration level; bond thickness; double-ended tuning fork; end boundary conditions; heterogeneous sensor; mode shapes; natural frequencies; output frequency; polyimide bonding material; quartz digital accelerometer; quartz resonant elements; residual assembly stresses; temperature behavior; temperature dependence; thermal stability; Accelerometers; Bonding; Copper; Finite element methods; Frequency; Polyimides; Resonance; Temperature dependence; Temperature sensors; Thermal stresses;
fLanguage
English
Journal_Title
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher
ieee
ISSN
0885-3010
Type
jour
DOI
10.1109/58.105253
Filename
105253
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