Electrical performance of interconnects in polyimide-copper thin-film multilayers on ceramic substrate

Author

Bedouani, Mohamed ; Lambert, Daniel ; Kurzweil, Karel

Author_Institution

Bull SA, Les Clayes sous Bois, France

Volume

19

Issue

2

fYear

1996

fDate

5/1/1996 12:00:00 AM

Firstpage

382

Lastpage

390

Abstract

Thin-film multilayer substrate technology with dielectric layers made of polyimide resin requires openings on the ground plane for the outgassing of the resin. This paper describes a full electrical characterization of transmission lines in a multichip module based on thin-film multilayer on ceramic. Both time and frequency domain methods were used for the experimental characterization. Measured and modeled performances are compared for three kinds of ground opening geometries

Keywords

ceramics; copper; integrated circuit interconnections; multichip modules; polymer films; substrates; thin film circuits; Cu; MCM; MCM-D technology; ceramic substrate; electrical performance; experimental characterization; frequency domain methods; ground opening geometries; interconnects; multichip module; polyimide resin; polyimide-Cu thin-film multilayers; resin outgassing; time domain methods; transmission lines; Ceramics; Dielectric measurements; Dielectric substrates; Dielectric thin films; Frequency domain analysis; Multichip modules; Nonhomogeneous media; Polyimides; Resins; Transmission line measurements;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.496042

Filename

496042