• DocumentCode
    910489
  • Title

    Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics

  • Author

    Patil, Nishad ; Celaya, Jose ; Das, Diganta ; Goebel, Kai ; Pecht, Michael

  • Author_Institution
    Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD
  • Volume
    58
  • Issue
    2
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    271
  • Lastpage
    276
  • Abstract
    Precursor parameters have been identified to enable development of a prognostic approach for insulated gate bipolar transistors (IGBT). The IGBT were subjected to thermal overstress tests using a transistor test board until device latch-up. The collector-emitter current, transistor case temperature, transient and steady state gate voltages, and transient and steady state collector-emitter voltages were monitored in-situ during the test. Pre- and post-aging characterization tests were performed on the IGBT. The aged parts were observed to have shifts in capacitance-voltage (C-V) measurements as a result of trapped charge in the gate oxide. The collector-emitter ON voltage VCE(ON) showed a reduction with aging. The reduction in the VCE(ON) was found to be correlated to die attach degradation, as observed by scanning acoustic microscopy (SAM) analysis. The collector-emitter voltage, and transistor turn-off time were observed to be precursor parameters to latch-up. The monitoring of these precursor parameters will enable the development of a prognostic methodology for IGBT failure. The prognostic methodology will involve trending precursor data, and using physics of failure models for prediction of the remaining useful life of these devices.
  • Keywords
    acoustic microscopy; ageing; failure analysis; insulated gate bipolar transistors; semiconductor device reliability; semiconductor device testing; thermal stresses; IGBT prognostics; SAM analysis; aging characterization test; capacitance-voltage measurement; collector-emitter current; collector-emitter voltage; die attach degradation; failure model; insulated gate bipolar transistor; precursor parameter identification; scanning acoustic microscopy; steady state gate voltage; thermal overstress test; transient voltage; transistor case temperature; Insulated gate bipolar transistors; precursors; prognostics;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.2009.2020134
  • Filename
    4967915