DocumentCode :
915435
Title :
A Rapid and Low-Cost Procedure for Fabrication of Glass Microfluidic Devices
Author :
Chen, Qiang ; Li, Gang ; Jin, Qing-Hui ; Zhao, Jian-Long ; Ren, Qiu-shi ; Xu, Yuan-Sen
Author_Institution :
Chinese Acad. of Sci., Shanghai
Volume :
16
Issue :
5
fYear :
2007
Firstpage :
1193
Lastpage :
1200
Abstract :
In this paper, we present a simple, rapid, and low-cost procedure for fabricating glass microfluidic chips. This procedure uses commercially available microscopic slides as substrates and a thin layer of AZ 4620 positive photoresist (PR) as an etch mask for fabricating glass microfluidic components, rather than using expensive quartz glasses or Pyrex glasses as substrates and depositing an expensive metal or polysilicon/amorphous silicon layer as etch masks in conventional method. A long hard-baking process is proposed to realize the durable PR mask capable of withstanding a long etching process. In order to remove precipitated particles generated during the etching process, a new recipe of buffered oxide etching with addition of 20% HCl is also reported. A smooth surface microchannel with a depth of more than 110 mum is achieved after 2 h of etching. Meanwhile, a simple, fast, but reliable bonding process based on UV-curable glue has been developed which takes only 10 min to accomplish the efficient sealing of glass chips. The result shows that a high bonding yield (~ 100%) can be easily achieved without the requirement of clean room facilities and programmed high-temperature furnaces. The presented simple fabrication process is suitable for fast prototyping and manufacturing disposable microfluidic devices.
Keywords :
bonding processes; etching; glass; microfluidics; substrates; UV-curable glue; bonding process; buffered oxide etching; durable PR mask; etching process; glass chips sealing; glass microfluidic chips; glass microfluidic device fabrication; hard-baking process; microfabrication; microscopic slides; precipitated particles; smooth surface microchannel; substrates; wet etching; Amorphous silicon; Bonding processes; Etching; Fabrication; Furnaces; Glass; Microchannel; Microfluidics; Microscopy; Resists; Microfabrication; UV bonding; microfluidic devices; wet etching;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2007.902467
Filename :
4337781
Link To Document :
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