Contact angle evaluation for laser cleaning efficiency

A laser cleaning technique using an excimer laser is introduced to remove the photoresist on a Si wafer surface and its cleaning characteristics have been investigated. To analyse the cleaning efficiency quantitatively, a scanning electronic microscope, energy dispersive spectroscope, surface scanner and contact angle measurement were employed. Among these methods, it was confirmed experimentally that the contact angle measurement could be applicable to analyse the laser cleaning efficiency effectively owing to its speed of measurement and low measurement cost.