Title :
Nanometer Cerium: A Significant Improvement Over Platinum in Bulk YBCO Superconductor
Author :
Sawh, Ravi-Persad ; Weinstein, Roy ; Parks, Drew ; Obot, Victor
Author_Institution :
Dept. of Phys., Univ. of Houston, Houston, TX, USA
fDate :
6/1/2009 12:00:00 AM
Abstract :
Large grain YBCO superconductors, containing the same atomic percentage of Ce, and that of Pt, were produced via the melt-texturing process. Samples doped with nanometer cerium oxide exhibits an approximate 30% increase in trapped magnetic flux density, relative to submicrometer platinum doped YBCO. A 30% increase in trapped magnetic flux density represents ~ 80% increase in critical current density. Microstructure studies indicate that just like Pt, Ce refines Y211 particles to increase trapped magnetic flux density and critical current density. Cerium is much cheaper than platinum and is therefore, a desirable alternative to Pt in the large-scale production of bulk YBCO superconductors. Another interesting result of this experiment is that the trapped magnetic flux density of Ce-doped samples is unchanging over a large range of melting temperatures used for melt-texturing. In addition to refined Y211, Ce-rich deposits are also formed. The Ce-rich particles are insufficient in number to act as effective pinning centers.
Keywords :
barium compounds; cerium compounds; critical current density (superconductivity); doping profiles; flux pinning; high-temperature superconductors; melt texturing; nanofabrication; nanoparticles; yttrium compounds; Ce-doped samples; Ce-rich particles; Y211 particles; YBa2Cu3O7-delta:CeO2; bulk YBCO superconductor; critical current density; effective pinning centers; grain YBCO superconductors; melt-texturing process; microstructure; nanometer cerium oxide; submicrometer platinum doped YBCO; trapped magnetic flux density; Enhancement in critical current density; melt-textured high temperature superconductors; nanometer cerium oxide doping; submicrometer platinum doping;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2009.2018550