Title :
Trends in cooperative distributed problem solving
Author :
Durfee, Edmund H. ; Lesser, Victor R. ; Corkill, Daniel D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fDate :
3/1/1989 12:00:00 AM
Abstract :
The authors present an overview of cooperative distributed problem solving (CDPS), an emerging research area that combines aspects of AI (artificial intelligence) and distributed processing. CDPS can be used to study how a loosely coupled network of sophisticated problem-solving nodes can solve a complex problem which consists of a set of interdependent subproblems. Subproblems arise because of spatial, temporal, and functional distribution of data, knowledge, and processing capabilities. Application areas include distributed interpretation, distributed planning and control, cooperating expert systems, and computer-supported human cooperation. The authors survey the important approaches and empirical investigations that have been developed. The approaches covered include negotiation, functionally accurate cooperation, organizational structuring, multiagent planning, sophisticated local control, and theoretical frameworks
Keywords :
distributed processing; knowledge engineering; problem solving; AI; CDPS; artificial intelligence; complex problem; computer-supported human cooperation; control; cooperating expert systems; cooperative distributed problem solving; data; distributed interpretation; distributed planning; distributed processing; functional distribution; functionally accurate cooperation; interdependent subproblems; knowledge; loosely coupled network; multiagent planning; negotiation; organizational structuring; processing capabilities; sophisticated local control; sophisticated problem-solving nodes; spatial; temporal; theoretical frameworks; Aircraft; Application software; Artificial intelligence; Control systems; Distributed computing; Distributed control; Expert systems; Humans; Intelligent agent; Problem-solving;
Journal_Title :
Knowledge and Data Engineering, IEEE Transactions on