• DocumentCode
    926319
  • Title

    Compact high-impedance surfaces incorporated with interdigital structure

  • Author

    Fu, Y. ; Yuan, N. ; Zhang, G.

  • Author_Institution
    Sch. of Electron. Sci. & Eng., Nat. Univ. of Defense Technol., Changsha, China
  • Volume
    40
  • Issue
    5
  • fYear
    2004
  • fDate
    3/4/2004 12:00:00 AM
  • Firstpage
    310
  • Lastpage
    311
  • Abstract
    A novel compact high-impedance surface structure is presented. The periodic branched elements cross over like interdigital capacitors. This structure is adopted to increase the fringe capacitor in order to compress the overall size of the high-impedance surface. Measured results show that 30-40% size reduction could be obtained.
  • Keywords
    capacitors; microwave integrated circuits; surface impedance; compact high-impedance surfaces incorporation; fringe capacitor; interdigital capacitors; interdigital structure; microwave circuits; size reduction; surface structure;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20040225
  • Filename
    1273948
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=926319