DocumentCode :
927041
Title :
Treatment of Chemical–Mechanical Planarization Wastes by Electrocoagulation/Electro- Fenton Method
Author :
Kin, Kon-Tsu ; Tang, Hong-Shiang ; Chan, Shu-Fei ; Raghavan, Srini ; Martinez, Sergio
Volume :
19
Issue :
2
fYear :
2006
fDate :
5/1/2006 12:00:00 AM
Firstpage :
208
Lastpage :
215
Abstract :
A method for the treatment of chemical–mechanical planaarization wastewater that utilizes the principles of electrocoagulation (EC) and electro-Fenton (EF) reactions has been investigated. The method consists of subjecting the wastewater to an applied electric field between two iron electrodes, in the presence of hydrogen peroxide. Dissolved iron is responsible for electrocoagulation, while the hydroxyl radicals produced through the reaction of dissolved iron species with hydrogen peroxide destroy dissolved organics. Over 95% of fine particles can be removed after sedimentation following exposure to electric field, and the turbidity of the clarified solution can be reduced to very low values (0.3 NTU).
Keywords :
CMP waste treatment; Chemical–mechanical planarization (CMP); electro-Fenton; electrocoagulation; Abrasives; Copper; Filtration; Iron; Organic chemicals; Planarization; Silicon compounds; Solids; Suspensions; Wastewater treatment; CMP waste treatment; Chemical–mechanical planarization (CMP); electro-Fenton; electrocoagulation;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2006.873511
Filename :
1628983
Link To Document :
بازگشت