Title :
Treatment of Chemical–Mechanical Planarization Wastes by Electrocoagulation/Electro- Fenton Method
Author :
Kin, Kon-Tsu ; Tang, Hong-Shiang ; Chan, Shu-Fei ; Raghavan, Srini ; Martinez, Sergio
fDate :
5/1/2006 12:00:00 AM
Abstract :
A method for the treatment of chemical–mechanical planaarization wastewater that utilizes the principles of electrocoagulation (EC) and electro-Fenton (EF) reactions has been investigated. The method consists of subjecting the wastewater to an applied electric field between two iron electrodes, in the presence of hydrogen peroxide. Dissolved iron is responsible for electrocoagulation, while the hydroxyl radicals produced through the reaction of dissolved iron species with hydrogen peroxide destroy dissolved organics. Over 95% of fine particles can be removed after sedimentation following exposure to electric field, and the turbidity of the clarified solution can be reduced to very low values (0.3 NTU).
Keywords :
CMP waste treatment; Chemical–mechanical planarization (CMP); electro-Fenton; electrocoagulation; Abrasives; Copper; Filtration; Iron; Organic chemicals; Planarization; Silicon compounds; Solids; Suspensions; Wastewater treatment; CMP waste treatment; Chemical–mechanical planarization (CMP); electro-Fenton; electrocoagulation;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2006.873511