DocumentCode
9275
Title
Compact multilayer self-packaged filter with surface-mounted packaging
Author
Ma, K. ; Fan, L. ; Zhang, S.
Author_Institution
Sch. of Phys. Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
51
Issue
7
fYear
2015
fDate
4 2 2015
Firstpage
564
Lastpage
566
Abstract
A new self-packaged bandpass filter by using multilayer print circuit board technology is proposed and investigated. By using a multilayer structure, a lumped step-impedance resonator as well as self-packaging, the designed filter can achieve a much more compact size, low insertion loss and a wide stopband. The implemented filter operated at a centre frequency of 800 MHz with a 3 dB bandwidth of 120 MHz demonstrates stopband rejection better than 25 dB up to 4 GHz. The measured insertion loss including the connector loss in the input and output is 1.48 dB. The size of the filter is only 12 × 8 mm, i.e. 0.059λg × 0.039λg.
Keywords
band-pass filters; printed circuits; resonator filters; surface mount technology; PCB; band pass filter; bandwidth 120 MHz; bandwidth 800 MHz; compact multilayer self-packaged filter; compact size; connector loss; insertion loss; lumped step-impedance resonator; multilayer print circuit board technology; multilayer structure; surface-mounted packaging;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2014.4129
Filename
7073746
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