• DocumentCode
    928
  • Title

    Permeability Enhancement by Multilayer Ferromagnetic Composites for Magnetic-Core On-Chip Inductors

  • Author

    Shah, Umer ; Liljeholm, Jessica ; Ebefors, Thorbjorn ; Oberhammer, Joachim

  • Author_Institution
    Dept. of Micro & Nanosyst., KTH R. Inst. of Technol., Stockholm, Sweden
  • Volume
    24
  • Issue
    10
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    677
  • Lastpage
    679
  • Abstract
    This letter reports about unpatterned ferromagnetic NiFe/AlN multilayer composites used as advanced magnetic core materials for on-chip and interposer integrated inductances. The proposed composite structure reduces RF induced currents and thus pushes the permeability cutoff to beyond 3.7 GHz, which is by a factor of 7.1 higher than for homogeneous NiFe layers of same thickness. To the best knowledge of the authors, we achieve the highest effective relative permeability of 28 at 1 GHz, highest ferromagnetic resonance frequency and highest inductance enhancement factor above 1 GHz ever reported for devices based on on-chip unpatterned NiFe magnetic cores. A single loop inductor is also implemented as a technology demonstrator, achieving an inductance enhancement of 4.8 and a quality factor enhancement of 4.5 at 400 MHz.
  • Keywords
    Q-factor; aluminium compounds; composite materials; ferromagnetic materials; ferromagnetic resonance; inductors; iron alloys; magnetic cores; multilayers; nickel alloys; permeability; NiFe-AlN; ferromagnetic resonance frequency; frequency 1 GHz; frequency 3.7 GHz; frequency 400 MHz; inductance enhancement factor; magnetic core materials; magnetic core on-chip inductors; multilayer ferromagnetic composites; permeability enhancement; quality factor enhancement; III-V semiconductor materials; Inductance; Inductors; Magnetic multilayers; Magnetic resonance; Nonhomogeneous media; Permeability; Magnetic materials; NiFe multilayer composite; micromachined inductors; microstrip; permeability; permittivity;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2014.2341037
  • Filename
    6866936