DocumentCode
929153
Title
Effects of microstructural defects in multilayer LTCC stripline
Author
Jang, Jae Hyuk ; Ishitobi, Norimasa ; Kim, Bruce C. ; Jeong, Seung Gyo
Author_Institution
R&D Center, Samsung Electro-Mech., Gyeunggi, South Korea
Volume
29
Issue
2
fYear
2006
fDate
5/1/2006 12:00:00 AM
Firstpage
314
Lastpage
319
Abstract
This paper proposes novel stripline models including embedded pores and sharpened conductor edges, which are commonly introduced during the multilayer low-temperature cofired-ceramic (LTCC) process. This model enables designers to obtain conductivity and tanδ of the stripline that are difficult to obtain using the experimental methods from arbitrary frequencies. This paper confirms that the proposed models are appropriate for LTCC striplines by comparing the simulated results with the experimental results. We found that embedded pores contributed to increase in unloaded quality factor (Qu) and characteristic impedance in the range of 5% to 6% while effective εr decreased in the range of 11%. Sharpened edges contributed to maximum peak in Qu and decreased characteristic impedance. These models will contribute to precision design of the future LTCC striplines.
Keywords
Q-factor; ceramic packaging; fault diagnosis; multilayers; strip lines; LTCC striplines; characteristic impedance; embedded pores; low-temperature cofired-ceramic process; microstructural defects; multilayer LTCC stripline; sharpened conductor edges; stripline models; unloaded quality factor; Ceramics; Circuit testing; Conducting materials; Dielectric constant; Frequency; Impedance; Microstructure; Nonhomogeneous media; Packaging; Stripline; Low-temperature cofired ceramic (LTCC); microstructure; modeling; stripline;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.850501
Filename
1629174
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