• DocumentCode
    932175
  • Title

    Failure modes and mechanisms for VLSI ICs¿a review

  • Author

    Fantini, F. ; Morandi, C.

  • Author_Institution
    Telettra S.p.A., Reliability & Quality Department, Bologna, Italy
  • Volume
    132
  • Issue
    3
  • fYear
    1985
  • fDate
    6/1/1985 12:00:00 AM
  • Firstpage
    74
  • Lastpage
    81
  • Abstract
    Knowledge of the electrical failure modes and of the physical mechanisms that cause faults is fundamental to implementing realistic fault models. Therefore, failure physics is the basis of effectual test sequence generation, and can give guidelines also for the design of testable and reliable integrated circuits. In the paper the failure modes and mechanisms of complex integrated circuits are reviewed. Faults are classified with respect to their allocation in the devices. Bulk defects, and failures in the dielectric layers, metallisation and package interconnections are then examined. Special attention is devoted to failures spurred by the reduction of dimensions for VLSI (`scaling¿)
  • Keywords
    VLSI; electrical faults; failure analysis; integrated circuit technology; monolithic integrated circuits; reviews; VLSI ICs; bulk defects; dielectric layers; dimensions reduction; electrical failure modes; fault models; integrated circuits; metallisation; monolithic IC; package interconnections; physical mechanisms; review; scaling;
  • fLanguage
    English
  • Journal_Title
    Electronic Circuits and Systems, IEE Proceedings G
  • Publisher
    iet
  • ISSN
    0143-7089
  • Type

    jour

  • DOI
    10.1049/ip-g-1:19850018
  • Filename
    4646466