Title :
Least-square estimation of the equivalent circuit parameters of a via-hole from a TDR reflectogram, including on-board rise time and delay estimation
Author :
Kok, Peter Albert ; De Zutter, Daniël
Author_Institution :
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
fDate :
5/1/1993 12:00:00 AM
Abstract :
Two different time-domain reflectometry (TDR)-based methods for estimating the equivalent circuit parameters of a via hole are presented. The first method is semigraphical, the second is a numerical estimation technique. Estimation is not restricted to equivalent circuit parameters, but onboard unknown rise times and delays are also included. Two possible models for a via hole are compared: a single capacitor model and a π-network, with two capacitances and an inductance. For certain categories of via hole, the inductive component turns out to be rather important
Keywords :
circuit analysis computing; equivalent circuits; least squares approximations; packaging; printed circuit testing; time-domain reflectometry; π-network; PCB; TDR reflectogram; de-embedding; delay estimation; device under test; equivalent circuit parameters; inductive component; least-square estimation; numerical estimation technique; on-board rise time; semigraphical method; single capacitor model; via-hole; Calibration; Capacitance; Capacitors; Connectors; Delay estimation; Equivalent circuits; Impedance; Inductance; Printed circuits; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on