DocumentCode
936729
Title
High-resolution AMI technique for evaluation of microelectronic packages
Author
Zhang, G.-M. ; Harvey, D.M. ; Braden, D.R.
Author_Institution
Eng. Dev. Centre, Liverpool John Moores Univ., UK
Volume
40
Issue
6
fYear
2004
fDate
3/18/2004 12:00:00 AM
Firstpage
399
Lastpage
400
Abstract
An acoustic micro-imaging (AMI) technique for the evaluation of microelectronic packages and populated circuit boards is proposed. The technique is based on the concepts of sparse signal representation in overcomplete time-frequency dictionaries. The experimental results demonstrate its superior ability to conventional AMI techniques.
Keywords
acoustic imaging; acoustic signal processing; echo; integrated circuit packaging; monolithic integrated circuits; time-frequency analysis; acoustic microimaging; circuit boards; echo; microelectronic packages; sparse signal; time-frequency analysis; ultrasonic signal;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20040267
Filename
1278134
Link To Document