Low-crosstalk 10-Gb/s flip-chip array module for parallel optical interconnects

Author

Park, Sang Hyun ; Park, Sung Min ; Park, Hyo-Hoon ; Park, Chul Soon

Author_Institution

Sch. of Eng., Inf. & Commun. Univ., Daejeon, South Korea

Volume

17

Issue

7

fYear

2005

fDate

7/1/2005 12:00:00 AM

Firstpage

1516

Lastpage

1518

Abstract

A 10-Gb/s optical receiver array with low interchannel crosstalk is realized by exploiting an InGaP-GaAs heterojunction bipolar transistor technology in a three-dimensional multilayer low-temperature cofiring ceramics (LTCC) module. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high-frequency crosstalk from on-chip bus and intermetallic capacitance. This module demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module with 0.8-dB power penalty.

Keywords

capacitance; ceramics; firing (materials); flip-chip devices; gallium arsenide; heterojunction bipolar transistors; indium compounds; modules; optical arrays; optical crosstalk; optical interconnections; optical multilayers; optical receivers; 10 Gbit/s; InGaP-GaAs; InGaP-GaAs heterojunction bipolar transistor; LTCC; flip-chip array module; inter-channel crosstalk; intermetallic capacitance; neutralization feedback circuit; on-chip bus; optical receiver array; parallel optical interconnects; suppressed-coupling; three-dimensional multilayer low-temperature cofiring ceramics; Capacitance; Ceramics; Crosstalk; Feedback circuits; Heterojunction bipolar transistors; Intermetallic; Nonhomogeneous media; Optical arrays; Optical interconnections; Optical receivers; Channel crosstalk; flip-chip; low-temperature cofiring ceramic (LTCC) substrate; parallel optical interconnects; transimpedance amplifier;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2005.848562

Filename

1453662