Title :
56th Electronic Components and Packaging Conference (ECPC 2006)
fDate :
4/1/2006 12:00:00 AM
Abstract :
Provides notice of upcoming conference events of interest to practitioners and researchers.
Keywords :
Electronic components; Electronics packaging;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2006.876552
