DocumentCode :
941545
Title :
Cross talk studies for superconducting transmission lines
Author :
Morisue, M. ; Lin, W. ; Furusawa, S. ; Yasutake, H. ; Isiguro, I.
Author_Institution :
Dept. of Electron. Eng., Saitama Univ., Urawa, Japan
Volume :
3
Issue :
1
fYear :
1993
fDate :
3/1/1993 12:00:00 AM
Firstpage :
2796
Lastpage :
2799
Abstract :
The authors describe the analysis of crosstalk on high-T/sub c/ superconducting transmission lines from the viewpoint of interconnection technology. They fabricated YBCO microstrip transmission lines on MgO substrate by sputtering and then measured the crosstalk by applying a high-speed pulse to the one line. They also calculated the current distributions in the YBCO superconductors and ground plane to evaluate the mutual inductance of the lines. After determining the circuit parameters of superconducting transmission lines based on the two-fluid model, they investigated by simulation how an induced pulse on the neighboring line propagates on the line. These simulation results show that the crosstalk on the superconducting transmission lines is smaller than that on the normal-conductor transmission lines owing to smaller mutual inductance of superconducting lines. These simulation results agree well with the experimental results.<>
Keywords :
barium compounds; crosstalk; current distribution; high-temperature superconductors; inductance; microstrip lines; sputtered coatings; superconducting microwave devices; superconducting thin films; waveguide theory; yttrium compounds; MgO substrate; YBaCuO-MgO; crosstalk; current distributions; high T/sub c/ superconductor; induced pulse; mutual inductance; pulse propagation; sputtering; superconducting transmission lines; two-fluid model; Circuit simulation; Crosstalk; Distributed parameter circuits; Inductance; Integrated circuit interconnections; Microstrip; Pulse measurements; Sputtering; Superconducting transmission lines; Yttrium barium copper oxide;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.233501
Filename :
233501
Link To Document :
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