DocumentCode :
943525
Title :
Fabrication of high frequency two-dimensional nanoactuators for scanned probe devices
Author :
Yao, J. Jason ; Arney, Susanne C. ; MacDonald, Noel C.
Author_Institution :
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Volume :
1
Issue :
1
fYear :
1992
fDate :
3/1/1992 12:00:00 AM
Firstpage :
14
Lastpage :
22
Abstract :
The authors have developed an integrated silicon process that uses suspended single crystal silicon (SCS) structures to fabricate x-y capacitive translators and high aspect ratio conical tips for scanned probe devices. The integrated nanomechanical device design and the process sequence include methods to form integrated tunneling tip pairs and to produce electrical isolation, contacts, and conductors. Each device occupies a nominal area of 40 μm×40 μm. These devices include a novel self-aligned tip-above-a-tip tunneling structure and capacitive x-y translators defined by electron beam lithography and the thermal oxidation of silicon. The x-y translators produce a maximum x-y displacement of ±200 nm for an applied voltage of 55 V. The low mass (2×10-13 kg), rigid structure has a measured fundamental mechanical resonant frequency of 5 MHz
Keywords :
electric actuators; electron beam lithography; electrostatic devices; elemental semiconductors; micromechanical devices; scanning tunnelling microscopy; silicon; 200 nm; 2E-13 kg; 40 micron; 5 MHz; 55 V; capacitive x-y translators; displacement; electrical conductors; electrical contacts; electrical isolation; electron beam lithography; fabrication; high aspect ratio conical tips; integrated Si process; integrated tunneling tip pairs; mass; mechanical resonant frequency; nanomechanical device design; process sequence; rigid structure; scanned probe devices; self-aligned tips; semiconductors; single crystal Si; suspended structures; thermal oxidation; two-dimensional nanoactuators; voltage; x-y capacitive translators; Conductors; Contacts; Electron beams; Fabrication; Frequency; Nanoscale devices; Probes; Process design; Silicon; Tunneling;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.128051
Filename :
128051
Link To Document :
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