DocumentCode
950567
Title
Power/Performance/Thermal Design-Space Exploration for Multicore Architectures
Author
Monchiero, Matteo ; Canal, Ramon ; González, Antonio
Author_Institution
HP Labs., Palo Alto
Volume
19
Issue
5
fYear
2008
fDate
5/1/2008 12:00:00 AM
Firstpage
666
Lastpage
681
Abstract
Multicore architectures have been ruling the recent microprocessor design trend. This is due to different reasons: better performance, thread-level parallelism bounds in modern applications, ILP diminishing returns, better thermal/power scaling (many small cores dissipate less than a large and complex one), and the ease and reuse of design. This paper presents a thorough evaluation of multicore architectures. The architecture that we target is composed of a configurable number of cores, a memory hierarchy consisting of private L1, shared/private L2, and a shared bus interconnect. We consider a benchmark set composed of several parallel shared memory applications. We explore the design space related to the number of cores, L2 cache size, and processor complexity, showing the behavior of the different configurations/applications with respect to performance, energy consumption, and temperature. Design trade-offs are analyzed, stressing the interdependency of the metrics and design factors. In particular, we evaluate several chip floorplans. Their power/thermal characteristics are analyzed, showing the importance of considering thermal effects at the architectural level to achieve the best design choice.
Keywords
microprocessor chips; shared memory systems; microprocessor design; multicore architectures; parallel shared memory applications; performance design-space exploration; power design-space exploration; power scaling; shared bus interconnect; thermal design-space exploration; thermal scaling; thread-level parallelism bounds; Energy-aware systems; Measurement; Modeling; Parallel Architectures; Shared memory; evaluation; multiple-processor systems; simulation of;
fLanguage
English
Journal_Title
Parallel and Distributed Systems, IEEE Transactions on
Publisher
ieee
ISSN
1045-9219
Type
jour
DOI
10.1109/TPDS.2007.70756
Filename
4359440
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