Title :
Elastoplastic Analysis of Surface-Mount Solder Joints
Author :
Lau, John H. ; Rice, Donald W. ; Avery, Phil A.
Author_Institution :
Hewlwtt-Packard Lab, CA
fDate :
9/1/1987 12:00:00 AM
Abstract :
Thermal strain in surface-mount chip resistor assemblies is studied by the finite element method using two- and three-dimensional models. Emphasis is placed on the effects of interconnection geometry on solder joint fatigue. Nine different solder joint geometries are considered.
Keywords :
Component reliability; FEM; Finite-element method (FEM); Resistors; Solders; Strain; Surface mounting; Thermal factors; Assembly; Capacitive sensors; Electronic equipment testing; Fatigue; Finite element methods; Geometry; Integrated circuit interconnections; Soldering; Surface-mount technology; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1987.1134753
