DocumentCode :
951581
Title :
A Comparison of Rapid Solidification Cast Versus Conventional Die Attach Soft Solders
Author :
Bowen, Robert C. ; Peterson, Deann M.
Author_Institution :
Cominco Electronic Materials,Spokane, WA
Volume :
10
Issue :
3
fYear :
1987
fDate :
9/1/1987 12:00:00 AM
Firstpage :
341
Lastpage :
345
Abstract :
Die attach soft solders manufactured by rapid solidification casting and by conventional methods were tested for several attributes and compared. Solders tested were Sn + 25%Ag + 10%Sb, Sn + 3.5%Ag, and Pb + 5%In + 2.5%Ag. Rapid solidification solders showed a much more refined structure than conventional solders, as well as exhibiting improved performance in wetting and mechanical strength tests. The results of our investigations showed that solder wettability was improved by about 15 percent for Sn + 3.5%Ag, to over 100-percent improvement for Sn + 25% Ag + 10%Sb and Pb + 5%In + 2.5%Ag. Solder joint shear strength was also improved by 75 percent or more for the solders tested. These results led to the conclusion that rapidly solidified Solders will yield improved performance.
Keywords :
Integrated circuit bonding; Materials processing; Solders; Billets; Casting; Cooling; Manufacturing; Microassembly; Refining; Scanning electron microscopy; Soldering; Testing; Tin;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1987.1134764
Filename :
1134764
Link To Document :
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