DocumentCode
952441
Title
Thick Film Techniques for Microwave Integrated Circuits
Author
Foster, Ted M. ; Digiondomenico, Oresto J.
Author_Institution
Westinghouse Elec. Corp., MD
Volume
10
Issue
2
fYear
1974
fDate
6/1/1974 12:00:00 AM
Firstpage
88
Lastpage
94
Abstract
A thick film approach to state-of-the-art microwave integrated circuits, which has been used to produce thousands of highly reliable low cost S-band and L-band solid state modules for production radar systems is described. These modules include low-noise amplifiers, double conversion mixers, interdigital filters, multiple port power dividers and switches, phase encoders, and power amplifiers. A discussion of the fabrication and microwave properties of thick film conductors, resistors, and capacitors is given along with photographs and performance data of various microwave integrated circuit modules that accumulated over a million device hours in operation without a failure.
Keywords
Microwave integrated circuits; Radar; Thick-film capacitors; Thick-film circuits; Thick-film resistors; Costs; Integrated circuit reliability; L-band; Low-noise amplifiers; Microwave devices; Microwave integrated circuits; Microwave theory and techniques; Power system reliability; Solid state circuits; Thick films;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1974.1134849
Filename
1134849
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