Title :
Interconnection Techniques for Microcircuits
Author :
Keister, F.Z. ; Engquist, R.D. ; Holley, J.H.
Author_Institution :
Hughes Aircraft Company, Culver City, CA
fDate :
3/1/1964 12:00:00 AM
Abstract :
The problem of how to interconnect today and tomorrow´s microminiature electronic circuit packages is one which is growing increasingly complex in view of the ever-diminishing size factor. It appears, however, that within a period of a few short years, many ingenious solutions to the interconnection problem have evolved. Some of these microcircuit interconnection techniques have proven their merit, while others are still under investigation. This paper describes twelve interconnection techniques, ranging from the relatively-simple soft soldering technique to highlyadvanced methods, such as electron beam welding and laser welding. An attempt has been made to present not only the mechanics of the various techniques, but to emphasize the materials, processes and equipment involved in each specific microcircuit interconnection method.
Keywords :
Copper; Electron beams; Integrated circuit interconnections; Integrated circuit reliability; Maintenance engineering; Optical materials; Packaging; Reliability engineering; Soldering; Welding;
Journal_Title :
Component Parts, IEEE Transactions on
DOI :
10.1109/TCP.1964.1134969