Integrated CMOS-MEMS with on-chip readout electronics for high-frequency applications

Author

Verd, J. ; Uranga, A. ; Teva, J. ; López, J.L. ; Torres, F. ; Esteve, J. ; Abadal, G. ; Pérez-Murano, F. ; Barniol, N.

Author_Institution

Univ. Autonoma de Barcelona, Spain

Volume

27

Issue

6

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

495

Lastpage

497

Abstract

A bridge-shaped first-lateral-mode 60-MHz mechanical resonator, which is monolithically integrated with capacitive CMOS readout electronics, is presented. The resonator is fabricated directly on a commercial CMOS technology using the top metal level as a structural layer. A maskless single-step wet-etching process for mechanical structure release after the standard CMOS integration process is the only postfabrication requirement. Electrical characterization of the electromechanical device demonstrates the feasibility of implementing a CMOS-microelectromechanical system for high-frequency applications using a standard conventional CMOS technology.

Keywords

CMOS integrated circuits; VHF devices; etching; micromechanical resonators; monolithic integrated circuits; readout electronics; 60 MHz; MEMS; VHF mechanical resonator; bridge-shaped mechanical resonator; capacitive CMOS; electromechanical device; first-lateral-mode mechanical resonator; high-frequency applications; maskless wet-etching; microelectromechanical system; monolithic integrated CMOS; on-chip readout electronics; single-step wet-etching; Bridge circuits; CMOS process; CMOS technology; Electrodes; Fabrication; Micromechanical devices; Radio frequency; Readout electronics; Transceivers; Wet etching; CMOS–microelectromechanical system (MEMS); high-frequency resonators; integrated resonators; mechanical resonators;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/LED.2006.875147

Filename

1637568