Interconnection of Integrated Circuit Flat Packs in Autonetics Improved Minuteman Program

Design studies for the Improved Minuteman computer reveal the necessity for advanced microcircuit interconnection techniques in order to capture the potential advantages of integrated circuits. The development of a unique multilayer board concept is described in terms of such factors as design procedures; masking techniques; and fabrication, test and rework methods. With reliability as the dominant factor in all trade-off studies the significance of physical and electrical parameters is discussed as well as the influence of considerations of producibility, yield, and system constraints.