DocumentCode
953322
Title
Quick inspection of power-plane short fault on multilayer substrate
Author
Chao, Fang-Lin ; Wu, Ruey-Beei
Author_Institution
Electron. Res. & Service Org., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Volume
18
Issue
3
fYear
1995
fDate
9/1/1995 12:00:00 AM
Firstpage
466
Lastpage
470
Abstract
A quick inspection approach for finding the powerplane short fault on multichip modules is proposed in this paper. The current source is applied on two diagonal corners of the power plane. The location of the short fault can be determined by as few as four voltage measurements. Also, the sheet conductivity of the power plane can be obtained as a by-product. Experiments have been performed and the successful prediction of the exact short point validates the present inspection approach
Keywords
fault location; inspection; integrated circuit testing; multichip modules; production testing; voltage measurement; MCM; multichip modules; multilayer substrate; power-plane short fault; powerplane short; quick inspection; sheet conductivity; voltage measurements; Chaos; Circuit faults; Conductivity; Costs; Inspection; Integrated circuit measurements; Multichip modules; Nonhomogeneous media; Switching circuits; Voltage measurement;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.465138
Filename
465138
Link To Document