DocumentCode
953407
Title
Coarse and detailed CFD modeling of a finned heat sink
Author
Linton, Ronald L. ; Agonafer, Dereje
Author_Institution
Risc Syst./6000 Div., IBM Corp., Austin, TX, USA
Volume
18
Issue
3
fYear
1995
fDate
9/1/1995 12:00:00 AM
Firstpage
517
Lastpage
520
Abstract
CFD modeling of electronic components becomes increasingly more important as CFD spreads into the design process. This paper compares the results of a detailed CFD model of a heat sink with experimental data. Then a technique for representing the heat sink in a coarse manner in a CFD model is presented and compared with the detailed CFD model. Agreement is quite good, indicating that this technique can be used when representing heat sinks in larger card or system models
Keywords
fluid dynamics; heat sinks; packaging; thermal resistance; CFD modeling; PHOENICS; card model; card on board packages; coarse model; computational fluid dynamics; electronic components; finned heat sink; pressure drop; system model; thermal resistance; Bonding; Computational fluid dynamics; Equations; Heat sinks; Heat transfer; Packaging; Power system modeling; Solid modeling; Temperature; Thermal resistance;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.465146
Filename
465146
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