• DocumentCode
    953429
  • Title

    Jet impingement boiling of a dielectric coolant in narrow gaps

  • Author

    Chrysler, Gregory M. ; Chu, Richard C. ; Simons, Robert E.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • Volume
    18
  • Issue
    3
  • fYear
    1995
  • fDate
    9/1/1995 12:00:00 AM
  • Firstpage
    527
  • Lastpage
    533
  • Abstract
    An experimental investigation into the effect of the chip-to-orifice gap was conducted for jet-impingement boiling of FC-72 at the back surface of a 6.5-mm square thermal chip on a 28-mm square ceramic substrate. Four different types of jets were used, all of them employing a single 0.50-mm diameter orifice. A fixed-position jet impingement pin with the orifice centered on a flat face measuring 7.62 mm on an edge was used as a base case. This jet supported a heat flux of about 120 W/cm2 at a reasonable flowrate. Variable-position jet impingement pistons were shown to perform as well as, but no better than the base case. Additional tests were conducted to investigate performance with variation in the chip-to-orifice gap. Thermal performance was found to be insensitive to the gap at large spacing, but below some specific gap it degraded with decreasing gap. A sudden jump in the chip temperature was discovered to occur at a specific gap. This gap length was found to vary with jet flowrate
  • Keywords
    boiling; channel flow; cooling; integrated circuit packaging; jets; 1.5 to 2 mm; FC-72; ceramic substrate; chip temperature jump; chip-to-orifice gap; dielectric coolant; electronics cooling; fixed-position jet impingement pin; jet flowrate; jet-impingement boiling; narrow gaps; thermal chip; thermal performance; variable-position jet impingement pistons; Ceramics; Coolants; Dielectric substrates; Orifices; Pistons; Semiconductor device measurement; Testing; Thermal conductivity; Thermal degradation; Thermal variables measurement;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.465148
  • Filename
    465148