• DocumentCode
    953594
  • Title

    Contact Properties of Tin Plates

  • Author

    Krumbein, Simeon J.

  • Author_Institution
    Yeshiva University, New York, N. Y.
  • Volume
    11
  • Issue
    2
  • fYear
    1975
  • fDate
    6/1/1975 12:00:00 AM
  • Firstpage
    148
  • Lastpage
    156
  • Abstract
    The low-load, dry circuit contact properties of typical tin plates have been investigated, with emphasis on the spherical indentor/flat configuration found in many connectors. The resistance was determined as a function of applied load for a variety Of plate combinations, as well as after exposure to a moist SO2accelerated corrosion test. The results Showed, among other things, that the contact behavior is critically dependent upon the properties of both halves of the contact system and that flats plated with matte tin behave better than those plated with bright tin.
  • Keywords
    Contacts; Environmental pollution; Circuits; Contacts; Current density; Gold; Nickel; Oxidation; Phosphors; Probes; Surface contamination; Tin;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1975.1135051
  • Filename
    1135051
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=953594