DocumentCode
953707
Title
Minimizing the computational cost and memory requirements for the capacitance calculation of 3-D multiconductor systems
Author
Ouda, Mohamed ; Sebak, Abdel-Razik
Author_Institution
Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
Volume
18
Issue
3
fYear
1995
fDate
9/1/1995 12:00:00 AM
Firstpage
685
Lastpage
689
Abstract
A new approach is presented which minimized the computational cost and memory requirements for capacitance calculations of three-dimensional multiconductor systems. The proposed approach, based on the integral equation method (IEM), calculated the capacitance of three-dimensional geometry of ideal conductors in two stages. In the first stage, the integral equation method was used to obtain the charge distribution on each conductor in isolation. In the second stage, the multiple interaction (coupling) among the conductors was included by applying the IEM to the whole structure and considering the charge distribution, obtained in the first stage, as a discretized entire domain basis function. The order of the interaction matrix was thus reduced to the order of conductors in the structure. The proposed method was tested for various geometries and it resulted in tremendous savings in computational time and memory storage; moreover, it gave very good accuracy in comparison with the classical integral equation method
Keywords
capacitance; circuit CAD; integral equations; integrated circuit design; integrated circuit packaging; 3D multiconductor systems; CAD; EM modelling; IC design; IC packaging; capacitance calculation; charge distribution; computational cost; discretized entire domain basis function; ideal conductors; integral equation method; memory requirements; multiple interaction; three-dimensional geometry; Aging; Capacitance; Circuit testing; Computational efficiency; Computational geometry; Conductors; Design automation; Integral equations; Integrated circuit modeling; Performance analysis;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.465170
Filename
465170
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