• DocumentCode
    953889
  • Title

    The High Temperature Deformation Properties of Gold and Thermocompression Bonding

  • Author

    Condra, Lloyd W. ; Svitak, John J. ; Pense, Alan W.

  • Author_Institution
    Bell Labs, North Andover, MA
  • Volume
    11
  • Issue
    4
  • fYear
    1975
  • fDate
    12/1/1975 12:00:00 AM
  • Firstpage
    290
  • Lastpage
    296
  • Abstract
    The flow stress of a high purity gold has been determined so that the contribution of plastic flow to the gold<jold thermocompression bonding process can be evaluated. These compression tests at 25°C, 158°C, 311°C, and 458°C indicate that for deformations over 15% the flow stress and the work hardening coefficient decrease rapidly with increasing temperature. Correlation of the compression test results and beam lead bonding experience indicates that high purity golds having a hardness of about 30 DPH would be expected to reach a steady state uniaxial flow stress of 70-90 MPa (10,000-13,000 psi) when deformed during bonding at 300°C.
  • Keywords
    Gold; Thermocompression bonding; Bonding forces; Ceramics; Friction; Gold; Plastic films; Surface contamination; Surface treatment; Temperature dependence; Testing; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1975.1135079
  • Filename
    1135079