DocumentCode
953889
Title
The High Temperature Deformation Properties of Gold and Thermocompression Bonding
Author
Condra, Lloyd W. ; Svitak, John J. ; Pense, Alan W.
Author_Institution
Bell Labs, North Andover, MA
Volume
11
Issue
4
fYear
1975
fDate
12/1/1975 12:00:00 AM
Firstpage
290
Lastpage
296
Abstract
The flow stress of a high purity gold has been determined so that the contribution of plastic flow to the gold<jold thermocompression bonding process can be evaluated. These compression tests at 25°C, 158°C, 311°C, and 458°C indicate that for deformations over 15% the flow stress and the work hardening coefficient decrease rapidly with increasing temperature. Correlation of the compression test results and beam lead bonding experience indicates that high purity golds having a hardness of about 30 DPH would be expected to reach a steady state uniaxial flow stress of 70-90 MPa (10,000-13,000 psi) when deformed during bonding at 300°C.
Keywords
Gold; Thermocompression bonding; Bonding forces; Ceramics; Friction; Gold; Plastic films; Surface contamination; Surface treatment; Temperature dependence; Testing; Thermal stresses;
fLanguage
English
Journal_Title
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0361-1000
Type
jour
DOI
10.1109/TPHP.1975.1135079
Filename
1135079
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