DocumentCode :
954572
Title :
Foreword
Author :
Tapp, Chris
Author_Institution :
IEEE PHP--1976
Volume :
12
Issue :
3
fYear :
1976
fDate :
9/1/1976 12:00:00 AM
Firstpage :
166
Lastpage :
166
Keywords :
Electronic components; Electronics packaging; Electrostatic discharge; Encapsulation; Hardware; MOS devices; Moisture; Protection; Resistors; Welding;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1976.1135144
Filename :
1135144
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=954572
