• DocumentCode
    956033
  • Title

    Mass Changes of Adhesives During Curing, Exposure to Water Vapor, Evacuation and Outgassing, Part I: Ablefilms 529, 535, and 550

  • Author

    Vasofsky, Richard W. ; Czanderna, Alvin W. ; Czanderna, Karel K.

  • Author_Institution
    Clarkson College of Tech.
  • Volume
    1
  • Issue
    4
  • fYear
    1978
  • fDate
    12/1/1978 12:00:00 AM
  • Firstpage
    405
  • Lastpage
    411
  • Abstract
    Mass losses of Ablefilms 529, 535, and 550 during curing ranged from 1-1.8 percent of the adhesive. The major gases evolved included the curing agent, solvent, water, carbon dioxide, and carbon monoxide. Exposure of Ablefilm 529 to 2.4 kPa (18 tort) water vapor yielded a saturation uptake of 0.27 percent of the sample mass, which could supply up to about ten times more water than needed for a dew point of 22°C in a volume of 40 mm3. Ablefilm 550 sorbed even greater quantifies of water.
  • Keywords
    Integrated circuit bonding; Carbon dioxide; Curing; Humidity; Materials science and technology; Packaging; Physics; Protection; Sealing materials; Semiconductor device measurement; Water resources;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1978.1135295
  • Filename
    1135295