• DocumentCode
    956261
  • Title

    Nondestructive Testing of Thru Connections in Printed Wiring Boards

  • Author

    Voida, George

  • Author_Institution
    Sandia Labs, Albuquerque,NM
  • Volume
    1
  • Issue
    2
  • fYear
    1972
  • fDate
    12/1/1972 12:00:00 AM
  • Firstpage
    2
  • Lastpage
    12
  • Keywords
    Assembly; Electronic equipment testing; Instruments; Integrated circuit interconnections; Manufacturing industries; Nondestructive testing; Plastics; Probes; Refining; Wiring;
  • fLanguage
    English
  • Journal_Title
    Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0046-838X
  • Type

    jour

  • DOI
    10.1109/TMFT.1972.1135319
  • Filename
    1135319
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=956261