• DocumentCode
    956352
  • Title

    Solderless Wrapped Connection

  • Author

    Mallina, R.F.

  • Author_Institution
    Bell Telephone Laboratories
  • Volume
    1
  • Issue
    1
  • fYear
    1956
  • fDate
    9/1/1956 12:00:00 AM
  • Firstpage
    12
  • Lastpage
    22
  • Abstract
    The solderless wrapped connection is introduced. The terms automatic factory and assembly are defined. Electronic industry growth over the last 30 years is discussed and its expansion during the next 10 years is predicted at 300 percent. The importance of modular building blocks and modular terminal spacing, in the program of standardization for automation, is emphasized. The solid-wire solderless wrapped connection is examined; hand wrapping tools, a wrapping gun and wrapping techniques are discussed. The high contact pressure principle is developed and documented by several photographs, drawings, arid curves. Data is presented concerning the relaxation of contact-tension with time and temperature. It is shown that tension reaches the 50 percent point in times varying from three hours (at 170 degrees C) to 40 years (at 57 degrees C). Reliability of the solderless wrapped connection and that of the solder connection are compared under vibration. Other advantages of the solderless wrapped connection are tabulated. Some applications to the wiring of telephone trunk circuit panels and general rack-and-panel wiring installations are given. Mr. Mallina concluded his talk by showing a motion picture of the wrapping gun in action.
  • Keywords
    Assembly; Circuits; Electronics industry; Manufacturing automation; Production facilities; Standardization; Telephony; Temperature; Wiring; Wrapping;
  • fLanguage
    English
  • Journal_Title
    Production Techniques, IRE Transactions on
  • Publisher
    ieee
  • ISSN
    0096-1779
  • Type

    jour

  • DOI
    10.1109/TPGPT.1956.1135329
  • Filename
    1135329