DocumentCode
956352
Title
Solderless Wrapped Connection
Author
Mallina, R.F.
Author_Institution
Bell Telephone Laboratories
Volume
1
Issue
1
fYear
1956
fDate
9/1/1956 12:00:00 AM
Firstpage
12
Lastpage
22
Abstract
The solderless wrapped connection is introduced. The terms automatic factory and assembly are defined. Electronic industry growth over the last 30 years is discussed and its expansion during the next 10 years is predicted at 300 percent. The importance of modular building blocks and modular terminal spacing, in the program of standardization for automation, is emphasized. The solid-wire solderless wrapped connection is examined; hand wrapping tools, a wrapping gun and wrapping techniques are discussed. The high contact pressure principle is developed and documented by several photographs, drawings, arid curves. Data is presented concerning the relaxation of contact-tension with time and temperature. It is shown that tension reaches the 50 percent point in times varying from three hours (at 170 degrees C) to 40 years (at 57 degrees C). Reliability of the solderless wrapped connection and that of the solder connection are compared under vibration. Other advantages of the solderless wrapped connection are tabulated. Some applications to the wiring of telephone trunk circuit panels and general rack-and-panel wiring installations are given. Mr. Mallina concluded his talk by showing a motion picture of the wrapping gun in action.
Keywords
Assembly; Circuits; Electronics industry; Manufacturing automation; Production facilities; Standardization; Telephony; Temperature; Wiring; Wrapping;
fLanguage
English
Journal_Title
Production Techniques, IRE Transactions on
Publisher
ieee
ISSN
0096-1779
Type
jour
DOI
10.1109/TPGPT.1956.1135329
Filename
1135329
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