DocumentCode
956431
Title
Amorphous-Silicon Thin-Film Transistors Fabricated at 300 °C on a Free-Standing Foil Substrate of Clear Plastic
Author
Cherenack, Kunigunde H. ; Kattamis, Alex Z. ; Hekmatshoar, Bahman ; Sturm, James C. ; Wagner, Sigurd
Author_Institution
Princeton Univ., Princeton
Volume
28
Issue
11
fYear
2007
Firstpage
1004
Lastpage
1006
Abstract
We have made hydrogenated amorphous-silicon thin-film transistors (TFTs) at a process temperature of 300degC on free-standing clear-plastic foil substrates. The key to the achievement of flat and smooth samples was to design the mechanical stresses in the substrate passivation and transistor layers, allowing us to obtain functional transistors over the entire active surface. Back-channel-passivated TFTs made at 300 degC on glass substrates and plastic substrates have identical electrical characteristics and gate-bias-stress stability. These results suggest that free-standing clear-plastic foil can replace display glass as a substrate from the points of process temperature, substrate and device integrity, and TFT performance and stability.
Keywords
amorphous semiconductors; passivation; semiconductor device manufacture; silicon; thin film transistors; back-channel-passivated TFT; device integrity; display glass; electrical characteristics; free-standing foil substrate; gate-bias-stress stability; glass substrates; hydrogenated amorphous-silicon thin-film transistors clear-plastic foil substrates; mechanical stress; plastic substrates; process temperature; substrate passivation layer; temperature 300 C; transistor layer; Displays; Electric variables; Glass; Passivation; Plastics; Stability; Stress; Substrates; Temperature; Thin film transistors; Amorphous silicon (a-Si); gate-bias stress; mechanical stress; plastic substrate; stability; thin-film transistor (TFT);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2007.907411
Filename
4367543
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